Recently, the Japanese Okayama University of Science, Golden Valley FAI professor and Sertec Nagata, Okayama County Industrial Technology Center, Hiroshima University of the day, such as professor, developed a surface reforming technology to improve the bonding strength of aluminum alloy and resin, “multilayer film anodizing treatment.”

The strength of the aluminum alloy and the high-performance resin by the epoxy adhesives is about 4 times higher than that of sulfuric acid and aluminum, which is 95 times higher than that without processing.

Its weatherability is excellent, it is expected to be used as the vehicle ⼦ Sub control Unit (ECU) and other harsh environmental conditions of transport equipment parts.

The single layer of anodic oxidation (acid-resistant aluminum) coating is usually multi-layer treated, which takes into account the adhesion and corrosion resistance.

2 kinds of anodic electrolysis on aluminum alloy, the multilayer oxide film formed on the surface can ensure the corrosion resistance of the lower layer, the adhesive flows into the fine concave and convex part of the bonding surface, the hardened fixed effect can improve the adhesion, the upper part and resin have a higher binder.

In addition, also has heat dissipation, in the high-temperature wet corrosion environment is difficult to peel off.

The new technology is based on acid-resistant aluminum, which is lower than the cost of electroplating materials. The processing device only needs to be appended on the usual equipment, and the corresponding automatic.

In addition, epoxy adhesives can be used to synthesize elastic rubber to improve the endurance of thermal cycling experiments.

According to the Japan Patent Office published “2013 annual Patent Application Technology Trends Survey Report” shows that Japan’s joint Technology patent application number ranked first.

When developing the bonding technology, it takes a great deal of effort to establish the technology before the full peel strength is achieved, and it will take a long time before it can be applied, so this is an area where short-term profit-making companies rarely get involved.

There are several technologies that can be used to securely splice resins and metals, such as the Plas in Japan, which developed the anchoring effect by setting fine grooves (micro-holes) on the metal surface and injecting the resin at this point in early 2000.

MEC, a Japanese circuit board manufacturer, implements the technology by using the metal treatment of pharmaceuticals to splice the resin.

In addition, some enterprises use other methods to set holes in the metal surface, one way is to use the laser, that is, the first careful laser irradiation, so that the metal surface after melting, then cut out the groove.

Some enterprises have also tried to use anodic oxidation treatment (acid-resistant aluminum treatment, the bonding object is limited to aluminum alloy).

In addition, in addition to resin and metal bonding, there is the technology of bonding different resins, such as the Japanese plastic plastics developed through the joint surface of the small pits to obtain anchoring effect of technology,

This technique is conceived to be used to splice glass fiber reinforced resin matrix composites while using lasers to melt the surfaces of molded resin products (called primary materials) while cutting out fine grooves on top.

Products applicable to FRP hand lay-up molding, winding molding, pultruded profiles, continuous plate, SMC, RTM, vacuum adsorption molding, and other processes.